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EDI CON CHINA 2018 in Bejing

26/03/2018

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Danyang Teruilai Electronics attended the EDI CON in Beijing from Mar 20-22th in 2018 .

We are honored to do be one of the attendees. EDI CON China is the place to talk about the entire system design, from simulation of components and systems, to materials/PCB boards, devices and foundry services, components, cables and connectors, testing, measurement, and verification. It’s talking about today’s RF and microwave challenges. It’s a chance to meet with industry experts and potential customers.

The EDI CON China exhibition brings together leading RF, microwave, high-speed digital, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD, and system solution providers in a single exhibition.


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